New encapsulation development for fine pitch IC devices

The continuous reduction of chip size driven by the market demand has a significant impact on circuit design and assembly process of IC packages. Shrinking chip size and increasing I/O counts require finer bond pad pitch and bond pad size for circuitry layout. As a result, serious wire deflection during transfer molding process could make adjacent wires short, and this issue becomes more critical as a smaller wire diameter has to be applied for the finer pitch wire bonded IC devices.This paper presents a new encapsulation process development for 50 μm fine pitch plastic ball grid array package. Since reduced wire diameter decreases the bending strength of bonded wires significantly, wire deflection during molding process becomes quite serious and critical. Experiments on conventional transfer molding were conducted to evaluate wire span threshold with 23.0 μm diameter gold wire. The results show that the wire span threshold is about 4.1 mm, which is much shorter than the wire span threshold of over 5.0 mm for wire with 25.4 μm diameter. Finite element analysis shows there is a significant difference in the wire deflection between 23.0 μm gold wire and 25.4 μm gold wire diameter under the same action of mold flow. A novel encapsulation method is introduced using non-sweep solution. The wire span could be extended to over 5.0 mm with wire sweep less than 1%. Reliability tests conducted showed that all the units passed 1000 temperature cycles (−55 to 125 °C) with JEDEC moisture sensitivity level 2a (60 °C/60% relative humidity for 120 h) and 3 times reflow (peak temperature at 220–225 °C). It is believed that this solution could efficiently overcome the risk of wire short issues and improve the yield of ultra fine pitch wire bonds in high-volume production.     

扇形段电磁搅拌对82B钢连铸坯成分和组织的影响

进行了结晶器搅拌和结晶器 +扇形段电磁搅拌连铸 82B钢 2 80mm× 380mm方坯的工业试验。结果表明 ,扇形段搅拌降低和改善了铸坯的中心偏析、疏松和夹杂物分布。 82B钢铸坯经扇形段搅拌后 ,中心部位碳含量峰值明显减小 ,碳偏析指数降低 5 7%～ 1 0 8% ,铸坯成分的方差值 (σ)减小 32 %～ 34 9%。     

川东地区井下套管损坏的原因分析及对策

本文就近年来在钻井施工中遇到的４口井发套管损坏的问题进行了原因分析，提出了防止井下套管损坏对策。     

橡塑共混热塑性弹性体的形态结构与性能

综述了影响共混热塑性弹性体的形态结构与性能的主要因素。     

Prognostic factors of early sequelae and fatal outcome of Japanese encephalitis

A clinical case control study to identify prognostic factors present at hospital admission associated with early sequelae and fatal outcome of acute Japanese encephalitis (JE) was carried out in Gusi county, Henan Province, central China from June to September 1991. A total of 70 patients with laboratory-confirmed acute JE were studied, of whom 3 cases died and 33 cases had neurological or psychiatric sequelae at the end of three months follow-up. The results showed that acute JE at younger age, with higher body temperature, high white cell count in CSF, and deep coma present at hospital admission were markers for unfavorable outcomes (sequelae or fatal). A history of the vaccination was not correlated with the early sequelae and fatal outcome of the disease. The paper suggests that early diagnosis and treatment and universal JE vaccination for all susceptible populations are keys for decreasing incidence of sequelae and fatal outcome of acute JE.     

复杂开采条件矿体三强回采作业技术应用

本文针对金翅岭金矿矿体开采条件极其复杂的情况，在采矿方法试验中，率先在岩金矿山采用了三强作业技术，既保证了安全回采，又取是了较好的技术经济指标。     

片状陶瓷材料高低温电性能参数的自动检测

由进口电性能仪配上自制的高温系统，计算机自动采集数据，配置成一套高低温电性参数测定装置，该装置的特点是，升温快，炉体小巧，炉芯可更换盛液氮装置，屏蔽良好，等温区长，温工及参数测量精确可靠。     

助剂对Pd/树脂醚化催化剂催化性能的影响 Ⅰ.铝助剂的影响

研究了不同助剂对Ｐｄ／树脂醚化催化剂在临氢条件下对催化裂化汽油Ｃ５馏份与甲醇和Ｈ２反应的催化性能的影响。结果表明，在Ｐｄ／树脂醚化催化剂中引入Ｚｒ、Ｔｉ、Ｂ、Ｓｎ和Ａｌ等助剂后，都能改善催化剂的醚化、双键异构和二烯烃选择性加氢活性，其中以Ａｌ、Ｓｎ为最好。Ａｌ助剂的体积质量和负载方式对Ｐｄ－Ａｌ／树脂醚化催化剂的活性有影响。ＢＥＴ方法和Ｘ－射线荧光光谱分析（ＸＦＳＡ）表明，Ａｌ助剂对Ｐｄ－Ａｌ／树脂醚化催化剂的表面积、孔结构和Ｐｄ离子交换量影响较小。     

La掺杂PZST反铁电陶瓷电场诱导热释电现象

研究了Ｌａ掺杂ＰＺＳＴ反铁电陶瓷在不同偏置电场下的场诱热释电特性。在０～１２０°Ｃ温度范围内，热释电的峰值和峰位可以用电场的大小来控制，热释电系数达到１０－７Ｃ／ｃｍ２·Ｋ。     

柠檬酸月桂醇酯的合成

介绍了柠檬酸月桂醇酯的合成方法,并经正交实验得出合成的最佳工艺条件:反应温度132℃,反应时间120min,月桂醇/柠檬酸=1:1(mol比),催化剂用量:0.2g。